NXT BOND

NXT BOND

NXT BOND3-m1 CELLULAR BONDING DEVICE

BLOCK DIAGRAM

This device aggregates multiple uplinks into a single pipe and allows for seamless failover from a wired to wireless network. It has 3xLTE cat 6/11 modems with global-band support, and aggregated speeds of up to 600/150 Mbps.

NXT BOND3-m1 CELLULAR BONDING DEVICE

NXT BOND3-m1 CELLULAR BONDING DEVICE

Motherboard Specification
CPU Intel® Celeron J1900, 2.0GHz Quad-Core SoC, 10W, Bay Trail
Chassis Specification
Product size 232 (W) * 152 (D) * 44 (H) mm
Environment Operating Temperature : 0 ∼ 50°C
Storage Temperature : -10 ∼ 70°C
Standard Accessory ✓ 60W AC-DC Adapter x1
✓ Power Cord x1
Functional Networking Appliance, Firewall/Router, Industrial Control, Digital Security, IoT SystemCE,FCC,ErP For Barebone
Certificate CE,FCC,TUV,UL,CCC,CB,ErP For Power Adapter

NXT BOND3-M1 CELLULAR BONDING DEVICE

This device aggregates multiple uplinks into a single pipe and allows for seamless failover from a wired to wireless network. It has 3xLTE cat 6/11 modems with global-band support, and aggregated speeds of up to 600/150 Mbps.

BLOCK DIAGRAM

NXT BOND3-M1 CELLULAR BONDING DEVICE

Motherboard SpecificationCPU
  • Intel® Celeron J1900, 2.0GHz Quad-Core SoC, 10W, Bay Trail
Chassis SpecificationProduct size
  • 232 (W) * 152 (D) * 44 (H) mm
Environment
  • Operating Temperature : 0 ∼ 50°C
  • Storage Temperature : -10 ∼ 70°C
Standard Accessory
  • ✓ 60W AC-DC Adapter x1
  • ✓ Power Cord x1
Functional
  • Networking Appliance, Firewall/Router, Industrial Contol, Digital Security, IoT SystemCE,FCC,ErP For Barebone
Certificate
  • CE,FCC,TUV,UL,CCC,CB,ErP For Power Adapter